Electro acoustic filter component and method of manufacturing to reduce influence of chipping
AssigneeRF360 Singapore Pte. Ltd.
InventorThomas Kauschke
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Abstract
An electro acoustic filter component with improved acoustic and/or electro acoustic performance is provided. The component comprises a piezoelectric material (PM) the sides of which are plane and preferably free from chipping defects. The piezoelectric material may be arranged above a carrier substrate (CS). A functional layer (FL) with plane sides may be arranged above an electrode structure (ES) as trimming, TCF or passivation layer. In the manufacturing method the piezoelectric material and the functional layer are removed from the dicing line, such that no chipping occurs for these layers.
Claims10
An electro acoustic filter component, comprising:
- a piezoelectric material in a piezoelectric layer disposed over a substrate;
- an electrode structure arranged on the piezoelectric layer;
- a functional layer encapsulating the electrode structure and sides of the piezoelectric material;
- and
- a cavity disposed over the functional layer,
- wherein the sides of the piezoelectric material are planar and wherein sides of the functional layer are planar.
Dependencies are inferred from the claim text.