Back to results
US 12,341,052 B2Granted
Wafer cleaning apparatus
AssigneeZeus Co., Ltd.
InventorsSeung Dae Baek, Sung Yup Kim, Nam Jin Kim
Life of this patent
Estimating the term…
Abstract
A wafer cleaning apparatus of the present invention includes a vacuum chuck unit on which a wafer is mounted, and an ultrasonic cleaning module configured to spray a cleaning solution onto the wafer and apply ultrasonic waves to the cleaning solution to ultrasonically vibrate the cleaning solution.
Claims18
A wafer cleaning apparatus comprising:
- a vacuum chuck unit on which a wafer is mounted;
- and
- an ultrasonic cleaning module configured to spray a cleaning solution onto the wafer and apply ultrasonic waves to the cleaning solution to ultrasonically vibrate the cleaning solution,
- wherein the ultrasonic cleaning module includes an ultrasonic cleaning part configured to spray the cleaning solution onto the wafer and apply the ultrasonic waves to the cleaning solution,
- wherein the ultrasonic cleaning part includes:
- an ultrasonic wave generator disposed inside a cleaning head to apply the ultrasonic waves to the cleaning solution;
- and
- a cleaning solution spray part formed in the cleaning head to spray the cleaning solution onto the wafer and spaced apart from the ultrasonic wave generator, and
- wherein a lower surface of the cleaning head is adjustably angled with respect to a surface of the wafer such that the cleaning solution spray part and the ultrasonic wave generator are disposed at different distances from the surface of the wafer.
6 more elements
Dependencies are inferred from the claim text.