Resin shaping device
AssigneeBondtech Co., Ltd.
InventorAkira Yamauchi
Life of this patent
Estimating the term…
Abstract
A resin shaping device configured to cure a resin placed in a mold in a state in which the mold is pressed against a substrate, the resin shaping device comprising: a substrate holding unit configured to hold the substrate in an orientation such that a forming face for forming a resin part on the substrate faces vertically downward; a head configured to hold the mold from vertically below; a head drive unit configured to cause the head to face a position for formation of a resin part on the substrate, and then cause vertically upward movement of the head so that the head approaches the substrate holding unit and presses the mold from vertically below the substrate; and a resin curing unit configured to cure the resin placed in the mold in a state in which the mold is pressed against the substrate.
Claims17
A resin shaping device configured to cure a resin placed in a mold in a state in which the mold is pressed against a substrate, the resin shaping device comprising:
- a substrate holding unit configured to hold the substrate in an orientation such that a forming face for forming a resin part on the substrate faces vertically downward;
- a head configured to hold the mold from vertically below;
- a head drive unit connected to the head configured to move the head to a position on the forming face for forming the resin part on the substrate, and the head drive unit configured to move the head vertically upward so that the head approaches the substrate holding unit, and presses the mold from vertically below the substrate;
- a resin curing unit comprises an ultraviolet irradiation unit coupled to a support configured to cure the resin while the resin is placed in the mold in the state in which the mold is pressed against the substrate;
- and
- a control unit that controls the head unit and the resin curing unit.
Dependencies are inferred from the claim text.