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US 12,341,008 B2Granted
Heat treatment device and treatment method
AssigneeTokyo Electron Limited
InventorYohei Sano
Life of this patent
Estimating the term…
Abstract
A heat treatment device includes: a heating plate configured to support and heat a substrate on which a metal containing resist film is formed; a chamber configured to cover a processing space above the heating plate; a gas supply configured to supply a gas into the chamber along a gas flow path connected to an inside of the chamber, the gas flow path being directed toward the substrate; and an exhaust port configured to evacuate inside of the chamber.
Claims7
A heat treatment device comprising:
- a heating plate configured to support and heat a substrate on which a metal containing resist film is formed;
- a chamber configured to cover a processing space above the heating plate;
- a gas supply configured to supply a gas into the chamber along a gas flow path connected to an inside of the chamber, the gas flow path being directed toward the substrate;
- and
- an exhaust port configured to evacuate the inside of the chamber.
2 more elements
A heat treatment method comprising:
- providing a heating plate in a chamber, the heating plate being configured to support and heat a substrate formed with a resist film;
- and
- performing a heat treatment on the substrate while injecting a processing gas to a processing space on the heating plate, supplying a gas into the chamber from below a surface of the substrate, and evacuating an inside of the chamber through an exhaust hole formed above the processing space within the chamber.
Dependencies are inferred from the claim text.