Tunable plasma exclusion zone in semiconductor fabrication
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChe Wei Yang, Chih Cheng Shih, Sheng-Chan Li, Cheng-Yuan Tsai, Sheng-Chau Chen
Life of this patent
Estimating the term…
Loading patent…
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChe Wei Yang, Chih Cheng Shih, Sheng-Chan Li, Cheng-Yuan Tsai, Sheng-Chau Chen
Estimating the term…
A tunable plasma exclusion zone in semiconductor fabrication is provided. A semiconductor wafer is provided within a chamber of a plasma processing apparatus between a first plasma electrode and a second plasma electrode. A plasma is generated from a process gas within the chamber and an electric field between the first plasma electrode and the second plasma electrode. The plasma is at least partially excluded from an edge region of the semiconductor wafer by a plasma exclusion zone (PEZ) ring within the chamber. The plasma may be tuned toward a center of the semiconductor wafer by electrically coupling an electrode ring of the PEZ ring to a voltage potential.
A plasma exclusion zone ring, comprising:
A plasma processing apparatus, comprising:
A plasma processing apparatus, comprising:
Dependencies are inferred from the claim text.