Apparatus for treating substrate and method for treating substrate

A substrate treating apparatus comprising:

• a chamber having an inner space;
• a plate-shape ion blocker dividing the inner space of the chamber into a first space and a second space below the first space, having a plurality of through holes, and grounded;
• a plasma source configured to apply an electric field to the first space;
• a first gas supply unit configured to supply a first process gas to the first space, the first process gas excited to a plasma when the first process gas is applied with an electric field of a first intensity at a first pressure atmosphere;
• a second gas supply unit configured to supply a second process gas to the second space;
• a support unit disposed in the second space and configured to support a substrate to be treated;
• and
• an electrodeless lamp disposed at a center of the ion blocker;
• and
• a controller,
• wherein the electrodeless lamp comprises:
• an electric field transmissive housing having a discharging space therein;
• and
• a discharging material including a luminous material and filling the discharging space, the discharging space of the housing being pressurized to a second pressure, and the discharging material discharging and luminating when applied with an electric field of a second intensity higher than the first intensity at a second pressure atmosphere, and
• the controller is configured to perform:
• a first treating for a divergence of an electric field of the first intensity by the plasma source at the first pressure atmosphere while supplying the first process gas from the first gas supply unit and supplying the second process gas from the second gas supply unit to generate a plasma from the first process gas, and treating a substrate with a reaction resultant between radicals of the plasma and the second process;
• and
• a second treating for discharging the electrodeless lamp to heat treat a substrate by stopping the supplying of the first process gas and the second process gas, exhausting the reaction resultant and causing the plasma source to diverge the electric field of the second intensity.