Method for forming silicon-phosphorous materials
AssigneeApplied Materials, Inc.
InventorsErrol Antonio C. Sanchez, Mark J. Saly, Schubert Chu, Abhishek Dube, Srividya Natarajan
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AssigneeApplied Materials, Inc.
InventorsErrol Antonio C. Sanchez, Mark J. Saly, Schubert Chu, Abhishek Dube, Srividya Natarajan
Estimating the term…
Embodiments generally relate to methods for depositing silicon-phosphorous materials, and more specifically, relate to using silicon-phosphorous compounds in vapor deposition processes (e.g., epitaxy, CVD, or ALD) to deposit silicon-phosphorous materials. In one or more embodiments, a method for forming a silicon-phosphorous material on a substrate is provided and includes exposing the substrate to a deposition gas containing one or more silicon-phosphorous compounds during a deposition process and depositing a film containing the silicon-phosphorous material on the substrate. The silicon-phosphorous compound has the chemical formula [(R3-vHvSi)—(R2-wHwSi)n]xPHyR′z, where each instance of R and each instance of R′ are independently an alkyl or a halogen, n is 0, 1, or 2; v is 0, 1, 2, or 3; w is 0, 1, or 2; x is 1, 2, or 3; y is 0, 1, or 2; z is 0, 1, or 2, and where x+y+z=3.
A method for forming a silicon-phosphorous material on a substrate, comprising:
A method for forming a silicon-phosphorous material on a substrate, comprising:
A method for forming a silicon-phosphorous material on a substrate, comprising:
Dependencies are inferred from the claim text.