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US 12,338,523 B2Granted
Method for patterning a substrate, a method for forming a microstructure on a substrate, and a method for fabricating a fluidic device
AssigneeCraif Inc.
InventorKeishu Tsuda
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Abstract
According to an embodiment of the present disclosure, a method for patterning a substrate is provided. In some embodiments, the method includes patterning a hydrophobic film formed on a surface of a substrate, applying a target material, and oxidizing at least the surface of the applied target material. In some embodiments, the method further includes removing the hydrophobic film from the substrate.
Claims12
A method for patterning a target material over a substrate, comprising:
- providing a substrate;
- forming a hydrophobic film on a surface of the substrate;
- patterning the hydrophobic film to expose a portion of the surface of the substrate;
- applying a target material to the portion of the surface of the substrate exposed by the patterning such that the hydrophobic film is exposed at another portion of the surface of the substrate;
- oxidizing the target material on the substrate;
- forming a microstructure on a surface of the oxidized target material before removing the hydrophobic film;
- and
- removing the hydrophobic film after said forming of the microstructure.
5 more elements
Dependencies are inferred from the claim text.