Dielectric film-forming composition
AssigneeFujifilm Electronic Materials U.S.A., Inc.
InventorsBinod B. De, William A. Reinerth, Sanjay Malik, Stephanie Dilocker, Raj Sakamuri
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Abstract
This disclosure relates to a dielectric film-forming composition that includes at least one cyclized polydiene resin, and one or both of at least one reactive functional compound and at least one catalyst.
Claims18
A process comprising applying a composition to a substrate, wherein the composition is a dielectric film-forming composition, comprising:
- at least one cyclized polydiene resin having a substituted or unsubstituted alkenyl group;
- at least one reactive functional compound having at least two functional groups capable of reacting with the substituted or unsubstituted alkenyl group on cyclized polydiene resin;
- and
- at least one catalyst capable of inducing reaction of the cyclized polydiene resin with the reactive functional compound, wherein the applying comprises:
- a) coating the dielectric film-forming composition on the substrate to form a film;
- and wherein the process further comprises:
- b) optionally baking the film at a temperature from about 50° C. to about 150° C. for about 20 seconds to about 240 seconds;
- and
- c) exposing the film to radiation, heat, or a combination thereof without a mask.
A process comprising applying a composition to a substrate, wherein the composition is a dielectric film-forming composition, comprising:
- at least one cyclized polydiene resin having a substituted or unsubstituted alkenyl group;
- at least one reactive functional compound having at least two functional groups capable of reacting with the substituted or unsubstituted alkenyl group on cyclized polydiene resin;
- and
- at least one catalyst capable of inducing reaction of the cyclized polydiene resin with the reactive functional compound, wherein the applying comprises
- a) coating the substrate with the dielectric film-forming composition, wherein the substrate is a carrier substrate;
- and wherein the process further comprises:
- b) drying the coated dielectric film-forming composition to form a dry film;
- and
- c) optionally, applying a protective layer to the dry film.
A process comprising applying a composition to a substrate, wherein the composition is a dielectric film-forming composition, comprising:
- at least one cyclized polydiene resin having a substituted or unsubstituted alkenyl group;
- at least one reactive functional compound having at least two functional groups capable of reacting with the substituted or unsubstituted alkenyl group on cyclized polydiene resin;
- and
- at least one catalyst capable of inducing reaction of the cyclized polydiene resin with the reactive functional compound, wherein the process is a process for depositing a conducting metal layer and the applying comprises
- a) depositing the dielectric-film forming composition on the substrate to form a dielectric film;
- and wherein the process further comprises:
- b) exposing the dielectric film to radiation or heat or a combination of radiation and heat;
- c) patterning the dielectric film to form a patterned dielectric film having openings;
- d) optionally depositing a seed layer on the patterned dielectric film;
- e) depositing a conducting metal layer in at least one opening in the patterned dielectric
- film;
- and
- f) optionally repeating steps a) to e) at least one time.
A process comprising applying a composition to a substrate, wherein the composition is a dielectric film-forming composition, comprising:
- at least one cyclized polydiene resin having a substituted or unsubstituted alkenyl group;
- at least one reactive functional compound having at least two functional groups capable of reacting with the substituted or unsubstituted alkenyl group on cyclized polydiene resin;
- and
- at least one catalyst capable of inducing reaction of the cyclized polydiene resin with the reactive functional compound, comprising:
- a) providing the substrate as a substrate containing conducting metal wire structures that form a network of lines and interconnects on the substrate;
- and wherein the applying comprises
- b) depositing the dielectric film-forming composition on the substrate to form a dielectric film;
- and wherein the process further comprises:
- c) exposing the dielectric film to radiation or heat or a combination of radiation and heat;
- and
- d) optionally, repeating steps a) to c) at least one time.
Dependencies are inferred from the claim text.