Copper alloy assembly and production method therefor
AssigneesKyushu University, National University Corporation, NGK Insulators, Ltd.
InventorsOsamu Takakuwa, Hisao Matsunaga, Takahiro Ishikawa, Hiromitsu Uchiyama, Masato Sakakibara, Masaaki Akaiwa
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Abstract
A copper alloy bonded body composed of a plurality of members made of an age-hardenable copper alloy, the members diffusion-bonded to one another. The copper alloy bonded body has undergone solution annealing and an aging treatment, the content of beryllium in the age-hardenable copper alloy is 0.7% by weight or less, and (i) a bonding interface between the members has disappeared and/or (ii) a bonding interface between the members remains, and an oxide film at the bonding interface has a thickness of 0 nm or more and 5.0 nm or less.
Claims23
A copper alloy bonded body composed of a plurality of members made of an age-hardenable copper alloy, the members diffusion-bonded to one another, wherein the copper alloy bonded body has undergone solution annealing including heating at a temperature of 700 to 1100° C. for 1 to 180 minutes and an aging treatment at 350 to 550° C. for 30 to 480 minutes,
- wherein a content of beryllium in the age-hardenable copper alloy is 0.7% by weight or less, and wherein:
- (i) a bonding interface between the members has disappeared and/or
- (ii) a bonding interface between the members remains, and an oxide film at the bonding interface has a thickness of 0 nm or more and 5.0 nm or less.
Dependencies are inferred from the claim text.