Method for electrochemically etching a semiconductor structure
AssigneeCambridge Enterprise Limited
InventorsRachel A. Oliver, Tongtong Zhu, Yingjun Liu, Peter Griffin
Life of this patent
Estimating the term…
Loading patent…
AssigneeCambridge Enterprise Limited
InventorsRachel A. Oliver, Tongtong Zhu, Yingjun Liu, Peter Griffin
Estimating the term…
A method for etching a semiconductor structure (110) is provided, the semiconductor structure comprising a sub-surface quantum structure (30) of a first III-V semiconductor material, beneath a surface layer (31) of a second III-V semiconductor material having a charge carrier density of less than 5×1017 cm−3. The sub-surface quantum structure may comprise, for example, a quantum well, or a quantum wire, or a quantum dot. The method comprises the steps of exposing the surface layer to an electrolyte (130), and applying a potential difference between the first III-V semiconductor material and the electrolyte, to electrochemically etch the sub-surface quantum structure (30) to form a plurality of nanostructures, while the surface layer (31) is not etched. A semiconductor structure, uses thereof, and devices incorporating such semiconductor structures are further provided.
A semiconductor structure comprising:
A semiconductor structure comprising:
A semiconductor structure comprising:
Dependencies are inferred from the claim text.