Metal dual interface card
AssigneeCompoSecure, LLC
InventorAdam Lowe
Life of this patent
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Abstract
A dual interface transaction card includes a metal card body having first and second surfaces. A contact-only transaction module is secured in the card body, the contact-only transaction module including contact pads disposed on the first surface of the card body and including a first transaction circuit. A contactless transaction module is secured in a void in the metal card body. The contactless transaction module includes a second transaction circuit and an antenna. Also disclosed is a process for manufacturing the dual interface transaction card. The process includes the steps of constructing a metal card body having the first and second surfaces, securing the contact-only transaction module in the metal card body, forming the void in the metal card body, and securing the contactless transaction module in the void.
Claims19
A transaction card comprising:
- a metal card body having first and second surfaces;
- a first module secured in the card body and comprising a first circuit;
- a second module secured in a void in the metal card body, the second module comprising a second circuit and an antenna, wherein (i) the first circuit and the second circuit are not physically electrically connected to one another and (ii) the first circuit and the second transaction circuit are not connected to any shared circuit component, and (iii) at least one of the first module and the second module comprises a transaction module;
- wherein the void comprises a blind pocket open to the second surface of the card body;
- and
- wherein the second module comprises an outer layer disposed flush with the second surface of the card body and the second module further comprises a layer containing the second circuit and the antenna, an RF shielding layer, and an adhesive layer;
- and
- wherein the second module comprises a multi-layer plug or disc that has a first outer layer aligned with the first surface of the card body and a second outer layer aligned with the second surface of the card body.
A process for manufacturing a transaction card, the process comprising the steps of:
- (a) constructing a metal card body having first and second surfaces;
- (b) securing a first module in the card body, the first module comprising a first circuit;
- (c) forming a void comprising a blind pocket open to the second surface of the card body;
- (d) securing a second module in the void, the second module comprising a second circuit and an antenna, wherein (i) the first circuit and the second circuit are not physically electrically connected to one another and (ii) the first circuit and the second transaction circuit are not connected to any shared circuit component, and (iii) at least one of the first module and the second module comprises a transaction module;
- and
- wherein the second module comprises an outer layer disposed flush with the second surface of the card body and the second module further comprises a layer containing the second circuit and the antenna, an RF shielding layer, and an adhesive layer;
- and
- wherein step (d) further comprises providing the second module as a multi-layer plug or disc that has a first outer layer aligned with the first surface of the card body and a second outer layer aligned with the second surface of the card body.
Dependencies are inferred from the claim text.