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US 12,331,457 B1Granted
Direct to film (DTF) transfer adhesive application unit with a vertical curing area
OwnerDennis Mooninventor
Life of this patent
Estimating the term…
Abstract
A direct to film (DTF) transfer adhesive application unit with a vertical curing area overcomes space constraints associated with conventional DTF systems having a horizontal curing area.
Claims3
A direct to film (DTF) transfer adhesive application unit with a vertical curing area comprising:
- a housing having an ingress and an egress for a printed film;
- a conveyor system configured to convey the printed film from the ingress to the egress;
- a dusting chamber positioned within the housing adjacent to the ingress, wherein the dusting chamber comprises a dusting system for applying adhesive powder to the printed film as the conveyor system conveys the printed film through the dusting chamber;
- a vertical curing chamber positioned within the housing between the dusting chamber and the egress, wherein the conveyor system is configured to convey the printed film sequentially from the ingress, through the dusting chamber, through the vertical curing chamber, and out of the housing through the egress.
1 more element
Dependencies are inferred from the claim text.