Deposition system and method
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWen-Hao Cheng, Hsuan-Chih Chu, Yen-Yu Chen
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Abstract
A deposition system is provided capable of cleaning itself by removing a target material deposited on a surface of a collimator. The deposition system in accordance with the present disclosure includes a substrate process chamber. The deposition includes a substrate pedestal in the substrate process chamber, the substrate pedestal configured to support a substrate, a target enclosing the substrate process chamber, and a collimator having a plurality of hollow structures disposed between the target and the substrate, a vibration generating unit, and cleaning gas outlet.
Claims20
A method of depositing a material from a target onto a substrate in a substrate process chamber, comprising:
- determining a condition of a substrate process chamber;
- placing the substrate process chamber in a chamber purging mode based on the condition of the substrate process chamber;
- applying vibration to a collimator in the substrate process chamber by applying the vibration to the collimator with one or more vibration generation units embedded within the collimator;
- and
- applying scrubbing gas to the collimator by introducing the scrubbing gas through one or more microchannels embedded within the collimator.
A method, comprising:
- determining a condition of a substrate process chamber;
- based on the condition of the substrate process chamber, positioning a substrate pedestal in a cleaning position and placing the substrate process chamber in a chamber purging mode;
- after positioning the substrate pedestal in the cleaning position and placing the substrate process chamber in the chamber purging mode, applying vibration to a collimator within the substrate process chamber by activating one or more vibration generation units embedded within the collimator to vibrate the collimator;
- and
- after positioning the substrate pedestal in the cleaning position and placing the substrate process chamber in the chamber purging mode, applying a scrubbing gas to the collimator within the substrate process chamber by passing a scrubbing gas through one or more microchannels embedded within the collimator to introduce the scrubbing gas into one or more openings.
A method, comprising:
- determining a condition of a substrate process chamber;
- placing the substrate process chamber in a chamber purging mode based on the condition of the substrate process chamber;
- applying vibration to a collimator in the substrate process chamber by activating one or more vibration generating units embedded within the collimator;
- and
- introducing a scrubbing gas into one or more openings of the collimator through one or more scrubbing gas outlets embedded within the collimator and in fluid communication with the one or more openings of the collimator and in fluid communication with one or more microchannels embedded within the collimator.
Dependencies are inferred from the claim text.