Modified epoxy acrylate prepolymer, photo-thermal dual-curing conductive adhesive, and preparation method therefor

A photo-thermal dual-curing conductive adhesive, having the following raw material composition by weight:

• 5% to 16% epoxy resin;
• 6% to 15% modified epoxy acrylate prepolymer;
• 2% to 6% a crosslinker;
• 2% to 5% a diluent;
• 1% to 3% a toughening agent;
• 70% to 85% surface modified silver powder;
• 0.3% to 1% a photoinitiator;
• 0.5% to 1.8% a latent curing agent;
• 0.4% to 1.2% a curing accelerator;
• and
• 1% to 3% an additive,
• wherein the surface modified silver powder is obtained by surface modification of silver powder with a silane coupling agent, and the silane coupling agent is at least one of a vinyl silane coupling agent and an epoxy silane coupling agent,
• wherein the modified epoxy acrylate prepolymer, prepared from in parts by weight 45 to 72 parts of epoxy resin, 12 to 20 parts of 1,4-butanediol diglycidyl ether, 7 parts to 26 parts of organic dibasic acid, 5 to 15 parts of acrylic acid, and 0.26 to 0.45 parts of polymerization inhibitor under the catalysis of 0.13 to 0.28 parts of catalyst,
• wherein a general structural formula of the organic dibasic acid is HOOC—R—COOH;
• in the formula, R is saturated aliphatic hydrocarbonyl, unsaturated aliphatic hydrocarbonyl or aromatic hydrocarbonyl, and the organic dibasic acid has a molecular weight of 90 to 300;
• and the modified epoxy acrylate prepolymer has an epoxy group content of 3% to 9%, a hydroxyl content of 3% to 10% and a vinyl content of 2% to 8%.