Flexible printed circuit board device for interfacing high density ultrasound matrix array transducer with integrated circuits
AssigneeVermon
InventorsGuillaume Férin, Philippe Vince
Life of this patent
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AssigneeVermon
InventorsGuillaume Férin, Philippe Vince
Estimating the term…
A flexible printed circuit board includes a central portion and one or more tabs extending from the central portion. The one or more tabs are foldable relative to the central portion. A plurality of pads are located within the central portion, and the plurality of pads are configured to electrically connect to a transducer. Lands are located within one of the one or more tabs, and electrical traces connect the plurality of pads and the lands. A method of manufacturing an electronics assembly includes providing a flexible printed circuit board with a plurality of central portions and folding the substrate such that the adjacent central portions are vertically stacked and the pads of adjacent central portions are electrically connected. Prior to folding the substrate, a transducer may be affixed to the plurality of pads and one or more electrical components may be affixed to the lands.
A flexible printed circuit board comprising:
A flexible printed circuit board comprising:
A method of manufacturing an electronics assembly, the method comprising the steps of:
Dependencies are inferred from the claim text.