Electronic device
AssigneeLeotek Corporation
InventorHuang-Tso Lin
Life of this patent
Estimating the term…
Abstract
An electronic device includes a housing, a dual-metal assembly, and a baffle. The housing has a through hole. The baffle is movably disposed in the housing. The baffle has at least one opening. The dual-metal assembly is connected to a side of the baffle and includes a first metal and a second metal. A thermal expansion coefficient of the first metal is different from a thermal expansion coefficient of the second metal, so that the dual-metal assembly is adapted to change between an initial state and a deforming state. When the dual-metal assembly is in the initial state, the opening is distant from the through hole. When the dual-metal assembly is in the deforming state, the dual-metal assembly drives the baffle to move, so that at least a portion of the opening is communicable with the through hole.
Claims10
An electronic device, comprising:
- a housing, having a through hole;
- a baffle, movably disposed in the housing, the baffle having at least one opening;
- and
- a dual-metal assembly, connected to a side of the baffle, the dual-metal assembly comprising a first metal and a second metal, wherein a thermal expansion coefficient of the first metal is different from a thermal expansion coefficient of the second metal, so that the dual-metal assembly is adapted to change between an initial state and a deforming state,
- wherein, when the dual-metal assembly is in the initial state, the opening is distant from the through hole;
- when the dual-metal assembly is in the deforming state, the dual-metal assembly drives the baffle to move, so that at least a portion of the opening is communicable with the through hole.
Dependencies are inferred from the claim text.