US 12,327,993 B2 · Semiconductor package for a multi-phase motor driving circuit

Abstract

A semiconductor package for a multi-phase motor driving circuit comprises a driving unit, a switching unit, a first bonding wire, and a second bonding wire. The driving unit comprises a first driving IC, a second driving IC and a third driving IC, configured to couple with a controller. The switching unit comprises a first pair of power switches, a second pair of power switches and a third pair of power switches, configured to couple with the first driving IC, the second driving IC and the third driving IC, respectively. The first bonding wire is coupled between a sensing pin of the first driving circuit and a connection between the driving unit and a motor driven by the driving. The second bonding wire is coupled between a fault out pin of the first driving IC, the second driving IC and the third driving IC.

Claims19

Dependent claims

A semiconductor package for a multi-phase motor driving circuit, comprising:

a driving unit, comprising a first driving IC and at least one second driving IC configured to couple with a controller;
a switching unit, comprising a first pair of power switches coupling to the first driving IC and at least one second pair of power switches coupling to the second driving IC;
a first bonding wire coupled directly between a sensing pin of the first driving IC and a connection between the driving unit and a motor driven by the driving unit;
and
a second bonding wire coupled between a fault out pin of the first driving IC and the second driving IC;
wherein the driving unit, the switching unit, the first bonding wire and the second bonding wire are situated on a leadframe of the semiconductor package.

3 more elements

A semiconductor package for a three-phase motor driving circuit, comprising:

a driving unit, comprising a first driving IC, a second driving IC and a third driving IC, configured to couple with a controller;
a switching unit, comprising a first pair of power switches, a second pair of power switches and a third pair of power switches, configured to couple with the first driving IC, the second driving IC and the third driving IC, respectively;
a first bonding wire coupled directly between a sensing pin of the first driving IC and a connection between the driving unit and a motor driven by the driving unit;
an output pin of the first driving IC, the second driving IC and the third driving IC;
and
a second bonding wire coupled between a fault out pin of the first driving IC, the second driving IC and the third driving IC;
wherein the driving unit, the switching unit, the first bonding wire and the second bonding wire are situated on a leadframe of the semiconductor package.

4 more elements

Dependencies are inferred from the claim text.

Semiconductor package for a multi-phase motor driving circuit

Life of this patent

Semiconductor package for a multi-phase motor driving circuit

Life of this patent

Abstract

Claims19