Chip with a silicon carbide substrate
AssigneeInfineon Technologies AG
InventorsStefan Krivec, Ronny Kern, Stefan Kramp, Gregor Langer, Hannes Winkler, Stefan Woehlert
Life of this patent
Estimating the term…
Abstract
A chip is provided. In an embodiment, the chip includes a silicon carbide substrate, a first sputtered metal layer on the silicon carbide substrate, and at least one second sputtered metal layer on the first sputtered metal layer. The first sputtered metal layer and the at least one second sputtered metal layer form an electrical contact. In another embodiment, the chip includes a silicon carbide substrate, a nickel-silicon layer on the silicon carbide substrate, and a layer sequence including a titanium layer, a nickel-containing layer, and a gold-tin or silver layer on the nickel-silicon layer.
Claims20
A chip, comprising:
- a silicon carbide substrate;
- a first sputtered metal layer on the silicon carbide substrate;
- and
- at least one second sputtered metal layer on the first sputtered metal layer,
- wherein the first sputtered metal layer and the at least one second sputtered metal layer form an electrical contact,
- wherein the first sputtered metal layer is a nickel-silicon layer.
A chip, comprising:
- a silicon carbide substrate;
- a nickel-silicon layer on the silicon carbide substrate;
- and
- a layer sequence comprising a titanium layer, a nickel-containing layer, and a gold-tin or silver layer on the nickel-silicon layer.
A chip, comprising:
- a silicon carbide substrate;
- a first sputtered metal layer on the silicon carbide substrate;
- and
- at least one second sputtered metal layer on the first sputtered metal layer,
- wherein the first sputtered metal layer and the at least one second sputtered metal layer form an electrical contact,
- wherein a plurality of semiconductor components formed in the silicon carbide substrate control a current flow between a contact at a frontside of the silicon carbide substrate and the electrical contact at a backside of the silicon carbide substrate.
Dependencies are inferred from the claim text.