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US 12,326,998 B2Granted
Ultrasonic transducer
AssigneeInfineon Technologies AG
InventorsKlaus Elian, Matthias Eberl, Horst Theuss, Rainer Markus Schaller, Fabian Merbeler
Life of this patent
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Abstract
An ultrasonic transducer includes at least one ultrasonic transducer element, a semiconductor chip that includes the ultrasonic transducer element, and a housing. The semiconductor chip is arranged in the housing. The semiconductor chip is embedded in a dimensionally stable encapsulation, wherein a contact surface of the dimensionally stable encapsulation is configured for acoustically coupling the ultrasonic transducer to a casing. Additionally, an ultrasonic transducer system and a method for fitting the ultrasonic transducer or ultrasonic transducer system are provided.
Claims19
An ultrasonic transducer, comprising:
- at least one ultrasonic transducer element;
- a semiconductor chip comprising the at least one ultrasonic transducer element;
- and
- a housing,
- wherein the semiconductor chip is arranged in the housing,
- wherein the semiconductor chip is embedded in a dimensionally stable encapsulation,
- wherein a contact surface of the dimensionally stable encapsulation is configured for acoustically coupling the at least one ultrasonic transducer element to a casing,
- wherein the housing comprises a base to which the semiconductor chip is coupled and sidewalls that define an opening,
- wherein the base and the sidewalls form a one-piece construction,
- wherein the semiconductor chip is arranged within the opening,
- wherein the dimensionally stable encapsulation fills at least a portion of the opening in order to encapsulate the semiconductor chip within the opening, and
- wherein the contact surface of the dimensionally stable encapsulation is arranged in the opening or protrudes from the opening.
9 more elements
An ultrasonic transducer system, comprising:
- an ultrasonic transducer comprising:
- at least one ultrasonic transducer element;
- a semiconductor chip comprising the at least one ultrasonic transducer element;
- and
- a housing,
- wherein the semiconductor chip is arranged in the housing,
- wherein the semiconductor chip is embedded in a dimensionally stable encapsulation,
- wherein a contact surface of the dimensionally stable encapsulation is configured for acoustically coupling the at least one ultrasonic transducer element to a casing,
- wherein the housing comprises a base to which the semiconductor chip is coupled and sidewalls that define an opening,
- wherein the base and the sidewalls form a one-piece construction,
- wherein the semiconductor chip is arranged within the opening,
- wherein the dimensionally stable encapsulation fills at least a portion of the opening in order to encapsulate the semiconductor chip within the opening, and
- wherein the contact surface of the dimensionally stable encapsulation is arranged in the opening or protrudes from the opening;
- and
- a carrier to which the housing is mechanically coupled,
- wherein the carrier is configured for mechanical coupling to the casing by adhesively bonding, screwing, or clipping, and
- wherein the carrier is configured to define, together with the casing, a cavity in which the housing is arranged.
14 more elements
A method for fitting an ultrasonic transducer, the method comprising:
- providing a semiconductor chip of the ultrasonic transducer, wherein the semiconductor chip comprises at least one ultrasonic transducer element of the ultrasonic transducer;
- providing a housing of the ultrasonic transducer,
- wherein the housing comprises a base to which the semiconductor chip is coupled and sidewalls that define an opening,
- wherein the base and the sidewalls form a one-piece construction, and
- wherein the semiconductor chip is arranged within the opening
- providing a dimensionally stable encapsulation within the opening of the housing, wherein the semiconductor chip is embedded in the dimensionally stable encapsulation, wherein the dimensionally stable encapsulation fills at least a portion of the opening in order to encapsulate the semiconductor chip within the opening, and wherein a contact surface of the dimensionally stable encapsulation is arranged in the opening or protrudes through the opening;
- and
- arranging the ultrasonic transducer, including the semiconductor chip, the housing, and the dimensionally stable encapsulation, within a cavity defined by a casing, wherein the contact surface of the dimensionally stable encapsulation is arranged in direct or indirect contact with the casing and is configured for acoustically coupling the at least one ultrasonic transducer element to the casing.
5 more elements
An ultrasonic transducer system, comprising:
- at least one ultrasonic transducer element;
- a semiconductor chip comprising the at least one ultrasonic transducer element;
- a casing configured to receive press-on pressures;
- a carrier, wherein the casing and the carrier define a cavity;
- a housing coupled to the carrier and arranged, within the cavity, between the casing and the carrier;
- and
- a dimensionally stable encapsulation in which the semiconductor chip is embedded,
- wherein the housing comprises a base to which the semiconductor chip is coupled and sidewalls that define an opening,
- wherein the semiconductor chip is arranged within the opening of the housing,
- wherein the dimensionally stable encapsulation fills at least a portion of the opening in order to encapsulate the semiconductor chip within the opening,
- wherein a contact surface of the dimensionally stable encapsulation is configured for acoustically coupling the at least one ultrasonic transducer element to the casing, and
- wherein the contact surface of the dimensionally stable encapsulation is arranged in the opening or protrudes from the opening.
9 more elements
Dependencies are inferred from the claim text.