Cooling flow in substrate processing according to predicted cooling parameters
AssigneeApplied Materials, Inc.
InventorsAla Moradian, Umesh Kelkar, Orlando Trejo, Elizabeth Kathryn Neville, Karthik Ramanathan
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AssigneeApplied Materials, Inc.
InventorsAla Moradian, Umesh Kelkar, Orlando Trejo, Elizabeth Kathryn Neville, Karthik Ramanathan
Estimating the term…
Technologies directed to cooling flow according to predicted cooling parameters for substrate processing are described. In some embodiments, a method includes receiving first data indicative of a process recipe for processing a substrate in a processing chamber of a substrate processing system. The method further includes inputting the first data into a model. The model includes a digital twin configured to represent thermal characteristics of the processing chamber. The method further includes receiving, via the model, a predicted value of a parameter associated with a flow of coolant through a cooling loop of the processing chamber. The method further includes causing coolant to flow through the cooling loop based on the predicted value of the parameter during execution of the process recipe in the processing chamber.
A method, comprising:
A system, comprising:
A non-transitory machine-readable storage medium comprising instructions that, when executed by a processing device, cause the processing device to:
Dependencies are inferred from the claim text.