Substrate integrated with passive device and method for manufacturing the same

A substrate integrated with a passive device, comprising:

• a transparent dielectric layer and a passive device integrated on the transparent dielectric layer;
• wherein the transparent dielectric layer comprises a first surface and a second surface, which are disposed oppositely along a thickness direction of the transparent dielectric layer;
• and the transparent dielectric layer is provided with a first connection via penetrating through the transparent dielectric layer along the thickness direction of the transparent dielectric layer;
• and
• the passive device comprises at least an inductor;
• the inductor comprises a first sub-structure on the first surface, a second sub-structure on the second surface, and a first connection electrode in the first connection via for sequentially connecting the first sub-electrode with the second sub-structure in series,
• wherein the passive device further comprises a capacitor;
• a first electrode plate of the capacitor and the second sub-structure of the inductor are in a same layer;
• the substrate further comprises a first interlayer dielectric layer on a side of the first electrode plate of the capacitor away from the transparent dielectric layer;
• and a second electrode plate of the capacitor is on a side of the first interlayer dielectric layer away from the first electrode plate of the capacitor.

A method for manufacturing a substrate integrated with a passive device, comprising:

• providing and processing a transparent dielectric layer to obtain the transparent dielectric layer provided with a first connection via therein, with the transparent dielectric layer comprising a first surface and a second surface which are oppositely disposed along a thickness direction of the transparent dielectric layer;
• and
• integrating a passive device, which at least comprises an inductor, on the transparent dielectric layer;
• wherein the integrating a passive device on the transparent dielectric layer comprises:
• forming a first sub-structure on the first surface of the transparent dielectric layer, forming a second sub-structure on the second surface of the transparent dielectric layer, and forming a first connection electrode in the first connection via;
• and the first sub-structure, the first connection electrode and the second sub-structure are connected to form a coil structure of the inductor,
• wherein the passive device further comprises a capacitor;
• a first electrode plate of the capacitor is further formed on the second surface with the second sub-structure being formed on the second surface;
• and the method further comprises:
• forming a first interlayer dielectric layer on a side of the first electrode plate of the capacitor away from the transparent dielectric layer;
• forming a second electrode plate of the capacitor on a side of the first interlayer dielectric layer away from the transparent dielectric layer;
• forming a second interlayer dielectric layer on a side of the second electrode plate of the capacitor away from the transparent dielectric layer, and forming a second connection via penetrating through the first interlayer dielectric layer and the second interlayer dielectric layer and a third connection via penetrating through the second interlayer dielectric layer;
• and
• forming a pattern comprising a second connection electrode and a connection pad by a patterning process on a side of the second interlayer dielectric layer away from the transparent dielectric layer;
• and the second connection electrode connects the second sub-structure to the second electrode plate of the capacitor through the second connection via and the third connection via.