Circuit board assembly and manufacturing method thereof

A circuit board assembly, comprising:

• a circuit board;
• an embedded chip embedded in and electrically connected to the circuit board;
• a heat dissipation assembly disposed on the circuit board and having a first electrically conductive contact and a second electrically conductive contact, wherein the heat dissipation assembly is thermally coupled to the embedded chip, and the first electrically conductive contact of the heat dissipation assembly is electrically connected to the circuit board;
• and
• a temperature switch structure located between at least a part of the circuit board and the second electrically conductive contact, wherein the temperature switch structure comprises a first metal layer and a second metal layer stacked on each other, the first metal layer of the temperature switch structure is electrically connected to the circuit board and is thermally coupled to the embedded chip, and a thermal expansion coefficient of the first metal layer is different from a thermal expansion coefficient of the second metal layer so that the temperature switch structure is deformed in response to a temperature change of the embedded chip to be in contact with or spaced apart from the second electrically conductive contact of the heat dissipation assembly.