Method of forming an integrated circuit package having a padding layer on a carrier

A method of forming an integrated circuit package, comprising:

• providing a first carrier;
• placing a lower semiconductor die on the first carrier;
• encapsulating the lower semiconductor die with a lower encapsulation layer;
• forming a first redistribution layer structure over the lower semiconductor die;
• placing a first semiconductor die and a second semiconductor die side by side on the first redistribution layer and placing an upper semiconductor die on the first semiconductor die;
• encapsulating the first semiconductor die, the second semiconductor die and the upper semiconductor die with a same upper encapsulation layer;
• bonding a second carrier to the second semiconductor die and the upper semiconductor die;
• and
• debonding the first carrier.

A method of forming an integrated circuit package, comprising:

• forming a dummy layer on a portion of a carrier;
• forming a first semiconductor die on the dummy layer and forming a second semiconductor die on the carrier;
• forming a third semiconductor die on the first semiconductor die and the second semiconductor die, wherein the third semiconductor die is partially overlapped with the first semiconductor die and the second semiconductor die in a cross-sectional view;
• debonding the carrier;
• removing the dummy layer and therefore exposing the first semiconductor die;
• and
• forming a fourth semiconductor die on the first semiconductor die opposite to the third semiconductor die.