Method of processing substrate

A method of processing a substrate, the method comprising:

• preparing a substrate, the substrate comprising a plurality of integrated circuit regions and a cutting region separating the integrated circuit regions from one another;
• and
• cutting the substrate along the cutting region,
• wherein the cutting of the substrate comprises:
• mounting the substrate on a concave mounting surface of a mounting table, and adsorbing the substrate to the concave mounting surface to conform to the concave mounting surface, thereby deforming a surface of the substrate into a concave shape;
• detecting, by a height sensor, a height of the deformed surface of the substrate in a vertical direction to generate a curved height profile line corresponding to a profile of the deformed surface of the substrate;
• determining positions of a plurality of first focus points on the curved height profile line of the deformed surface of the substrate detected by the height sensor, wherein the plurality of first focus points are located in the substrate;
• and
• forming a first modification layer in the substrate by irradiating the plurality of first focus points with a laser beam, wherein
• the plurality of first focus points are provided in the cutting region and are each the same distance from the surface of the substrate.

A method of processing a substrate, the method comprising:

• preparing a substrate, the substrate comprising a plurality of integrated circuit regions and a cutting region separating the integrated circuit regions from one another;
• and
• cutting the substrate along the cutting region,
• wherein the cutting of the substrate comprises:
• transferring the substrate onto a mounting surface of a mounting table, the mounting surface comprising a concave surface;
• deforming a surface of the substrate into a concave shape by vacuum-adsorbing the substrate to the mounting surface of the mounting table;
• detecting, by using a height sensor, heights at a plurality of measurement points on the surface of the substrate at the same time that the mounting table moves in a first horizontal direction in relation to the height sensor,
• determining positions of a plurality of first focus points based on height data of the surface of the substrate detected by the height sensor;
• and
• forming a first modification layer in the substrate by irradiating the plurality of first focus points with a laser beam at the same time that the mounting table moves in a second horizontal direction opposite the first horizontal direction in relation to the height sensor,
• wherein the plurality of first focus points are on a first focus line that is offset by a uniform distance from the surface of the substrate,
• the laser beam is an infrared ray, and
• a distance in a vertical direction between an edge of the mounting surface of the mounting table and a center of the mounting surface is from about 25 μm to about 800 μm.