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US 12,322,588 B2Granted
Stimulus responsive polymer films and formulations
AssigneeLam Research Corporation
InventorsGregory Blachut, Diane Hymes, Stephen M. Sirard
Life of this patent
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Abstract
Formulations for forming stimulus responsive polymers (SRPs) on semiconductor substrates include organic weak acids. Methods of protecting sensitive substrates including forming an SRP layer on sensitive substrates and forming one or more cap layers on the SRP layer.
Claims22
A method comprising:
- forming an SRP layer, wherein the SRP layer is a layer comprising a stimulus responsive polymer (SRP), the SRP characterized by a ceiling temperature (Tc) at which the SRP is in thermal equilibrium with its monomers, the Tc being between −80° C. and 400° C., on a sensitive surface of a substrate;
- and forming one or more cap layers on the SRP layer, wherein the SRP layer and the one or more cap layers are configured to protect the sensitive surface from environmental effects during queue-time in a fabrication facility.
A formulation comprising:
- a stimulus responsive polymer (SRP) characterized by a ceiling temperature (Tc) at which the SRP is in thermal equilibrium with its monomers, the Tc being between −80° C. and 400° C.;
- and
- an organic acid having a pKa≥1, wherein the SRP:
- organic acid wt % is at least 1:1.
1 more element
A processing tool comprising
- one or more semiconductor processing chambers connected under vacuum;
- and
- a controller comprising instructions for
- a) forming an SRP layer, wherein the SRP layer is a homogenous layer comprising a stimulus responsive polymer (SRP), the SRP characterized by a ceiling temperature (Tc) at which the SRP is in thermal equilibrium with its monomers, the Tc being between −80° C. and 400° C., on a sensitive surface of a substrate;
- and
- b) forming one or more cap layers on the SRP layer.
3 more elements
Dependencies are inferred from the claim text.