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US 12,320,778 B2Granted
Method of processing substrate, substrate processing apparatus, method of manufacturing semiconductor processing apparatus, and recording medium
AssigneeKokusai Electric Corporation
InventorsTeruo Yoshino, Naofumi Ohashi, Toshiro Koshimaki
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Abstract
There is provided a technique that includes abnormality detecting by picking up a sound generated from a transfer configured to operate in a vacuum and transport a substrate in a vacuum transfer chamber and compare the sound information with a preset threshold value to detect an abnormality of the transfer. The transfer includes a gas-filled container arranged in the vacuum transfer chamber and filled with a gas and a microphone installed inside the gas-filled container.
Claims16
A substrate processing apparatus, comprising:
- a process chamber configured to be capable of processing a substrate;
- a first transfer chamber configured to be capable of accommodating a first transfer that includes a gas-filled container filled with a gas and is configured to be capable of transporting the substrate to the process chamber in a vacuum;
- a sound information receiver configured to be capable of receiving sound information detected by a first microphone installed inside the gas-filled container;
- and
- an abnormality detector configured to be capable of detecting an abnormality of the first transfer by comparing the sound information with a preset threshold value.
2 more elements
Dependencies are inferred from the claim text.