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US 12,319,781 B2Granted
Rehealable and reworkable polymer for electronic packaging
AssigneeInternational Business Machines Corporation
InventorsRudy J. Wojtecki, Gregory Breyta, Kamal K. Sikka, Teddie P. Magbitang
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Abstract
A composition, process, and device are disclosed. The composition includes a polymer formed by reacting an epoxy compound with an amine curing agent. The epoxy compound comprises a Diels-Alder dimer and an ester moiety. The process includes providing a polymer formed by reacting the epoxy compound with the amine curing agent. The device includes a material that includes the polymer.
Claims20
A process, comprising:
- providing a polymer comprising thermally reversible repeat units, wherein:
- the polymer is formed by curing a Diels-Alder dimer with an amine curing agent;
- and
- the Diels-Alder dimer comprises an epoxy moiety and an ester moiety;
- providing a chip connected to a first location on a laminate by solder balls and by an underfill comprising the polymer;
- and
- removing the chip from the laminate by, while applying heat, treating the underfill with a depolymerization mixture comprising an amine catalyst and a protic solvent.
4 more elements
Dependencies are inferred from the claim text.