Hypoallergenic aspartic resin complex and preparation process thereof

A hypoallergenic aspartic resin complex, comprising the following components:

• (A) a polyaspartic resin with a structure represented by formula (1) below,
• wherein R1 and R2 are independently selected from C1-C4-alkyls, X is selected from polyvalent organic structures left after removal of primary amino groups of polyamine compounds, and the polyvalent organic structures have an average molecular weight of 50-5000 and are inert to isocyanate groups at 100° C., and n=2-3;
• (B) a monoamine maleate adduct with a structure represented by formula (2) below,
• wherein R3 is selected from organic groups left after removal of one H atom from an amino group in organic amine compounds, the organic amine compounds contain one primary amino group or one secondary amino group and have a molecular weight of not greater than 150, and Et represents ethyl;
• and
• (C) at least one of diethyl fumarate or diethyl maleate, a content of which is not greater than 0.5% by weight in the hypoallergenic aspartic resin complex;
• wherein the organic amine compound is one or more of organic amine compounds with a general chemical formula (3) or (4) below;
• R4NH2 (3)
• wherein R4 is selected from C5-C6-cycloalkyls or C6-C10-substituted cycloalkyls;
• R5NHR6 (4)
• wherein R5 and R6 are independently selected from C1-C4-alkyls.