Multi-layer release stack for light induced transfer of components

A donor substrate comprising:

• a transparent carrier carrying components for light induced transfer with a release stack disposed between the transparent carrier and the components for releasing one or more of the components from the donor substrate following illumination of the release stack by a light beam through the transparent carrier,
• wherein the release stack comprises:
• a melt layer formed by a metal or alloy layer having first melting temperature,
• a light-absorbing layer disposed between the transparent carrier and the melt layer, wherein the light-absorbing layer has an absorption coefficient for absorbing at least ten percent of a light beam in a wavelength range between 100-200 nm and a pulse length less than ten nanoseconds, thereby causing the light-absorbing layer to be heated, wherein the light-absorbing layer is in thermal contact with the melt layer for conducting its heat to the melt layer thereby causing a temperature of the melt layer to rise above the first melting temperature, wherein the light-absorbing layer has a second melting temperature which is higher than the first melting temperature of the melt layer such that the light-absorbing layer can remain solid while the melt layer is melted by the heat conducted from the light-absorbing layer, and
• an adhesive layer formed by an organic or non-metal layer configured to adhere the components to the melt layer while the melt layer is solid and release adhesion when the melt layer is melted.

A system for light induced transfer of components, the system comprising:

• a light source configured to generate a light beam;
• a donor substrate comprising a transparent carrier and a release stack with a light-absorbing layer, a melt layer, and an adhesive layer holding one or more components for light induced transfer by the light beam;
• and
• an acceptor substrate configured to receive the one or more components transferred from the donor substrate by the light beam;
• wherein the release stack is disposed between the transparent carrier and the one or more components for releasing the one or more components from the donor substrate following illumination of at least part of the release stack by the light beam through the transparent carrier,
• wherein the melt layer is formed by a metal or alloy layer having a first melting temperature,
• wherein the light-absorbing layer is disposed between the transparent carrier and the melt layer, wherein the light-absorbing layer is configured to absorb at least part of the light beam to cause an illuminated part of the light-absorbing layer to be heated by the light beam, wherein the light-absorbing layer is in thermal contact with the melt layer for conducting its heat to the melt layer thereby causing a temperature of the melt layer to rise above its melting temperature, wherein the light-absorbing layer has a second melting temperature which is higher than the first melting temperature of the melt layer such that the light-absorbing layer can remain solid while the melt layer is melted by the heat conducted from the light-absorbing layer;
• and
• wherein the adhesive layer is formed by an organic or non-metal layer configured to adhere the one or more components to the melt layer while the melt layer is solid and releasing adhesion when the melt layer is melted.