Method for soldering heating elements to create an electric heating device or a heating source; corresponding electric heating device

A heating device comprising at least one body which incorporates at least one housing containing a linear heating element formed by at least one heating resistor, produced by a method comprising the following steps:

• supplying or producing and preparing the at least one body, the at least one body comprising:
• the at least one housing containing the at least one linear heating element formed by the at least one heating resistor, wherein at least one mineral-insulated cable constitutes said at least one heating resistor, and
• one or more chambers constituting one or more casting reservoirs containing a pure solder material that is in a solid fragmented form or a solid monobloc form, wherein said one or more casting reservoirs communicate with said at least one housing via one or more casting channels, which are arranged to permit said solder material, once melted, to pass through said one or more casting channels, fill a space in said at least one housing surrounding said at least one heating resistor and embed said at least one mineral-insulated cable, at least by gravity and/or in response to a differential pressure;
• said casting reservoirs containing a quantity of solder material sufficient for filling said at least one housing around said at least one heating resistor;
• and
• heating said at least one body in a kiln to a temperature sufficient to melt said solder material, thereby resulting in a casting of melted solder material via said one or more casting channels.

A heating device constituting a heating plate for a semiconductor wafer, produced by a method comprising the following steps:

• supplying or producing and preparing the at least one body, the at least one body comprising:
• the at least one housing containing the at least one linear heating element formed by the at least one heating resistor, wherein at least one mineral-insulated cable constitutes said at least one heating resistor, and
• one or more chambers constituting one or more casting reservoirs containing a pure solder material that is in a solid fragmented form or a solid monobloc form, wherein said one or more casting reservoirs communicate with said at least one housing via one or more casting channels, which are arranged to permit said solder material, once melted, to pass through said one or more casting channels, fill a space in said at least one housing surrounding said at least one heating resistor and embed said at least one mineral-insulated cable, at least by gravity and/or in response to a differential pressure;
• said casting reservoirs containing a quantity of solder material sufficient for filling said at least one housing around said at least one heating resistor;
• and
• heating said at least one body in a kiln to a temperature sufficient to melt said solder material, thereby resulting in a casting of melted solder material via said one or more casting channels;
• wherein the body comprises a flat support plate which is designed to accommodate an object to be heated, the flat support plate having a thickness in which a plurality of linear housings are formed, which receive and surround the at least one linear heating element in a substantially complementary manner;
• and wherein said body incorporates one or more casting reservoirs, which communicate with said linear housings from a position which extends transversely to the plane of said flat support plate, wherein the flat support plate comprises at least two independent heating elements.