Wire drawing die
AssigneesA.L.M.T. Corp., Sumitomo Electric Industries, Ltd.
InventorsKohei Kuramoto, Takuya Kinoshita, Yutaka Kobayashi, Makoto Yukawa, Kohichiroh Kimura, Kentaro Shiro
Life of this patent
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Abstract
A wire drawing die 1 includes a non-diamond material, is provided with a die hole 1h, and has a reduction 1c and a bearing 1d that is positioned downstream of the reduction 1c. A reduction angle γ which is an opening angle of the die hole 1h at the reduction 1c is less than or equal to 17°, and a surface roughness Ra of the die hole 1h within ±20 μm from a specific position inside the bearing 1d in a circumferential direction of the die hole 1h that is perpendicular to a wire drawing direction is less than or equal to 0.025 μm.
Claims7
A wire drawing die comprising a non-diamond material having a die hole, a reduction, and a bearing positioned downstream of the reduction, wherein
- the non-diamond material includes CBN, and
- a reduction angle which is an opening angle of the die hole at the reduction is less than or equal to 17°, a length L of the bearing is less than or equal to 200% D, where D is a diameter of the bearing, and a surface roughness Ra of the die hole within ±20 μm from a specific position inside the bearing in a circumferential direction of the die hole that is perpendicular to a wire drawing direction is less than or equal to 0.025 μm.
Dependencies are inferred from the claim text.