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US 12,317,749 B1Granted
Actuator designs for MEMS-based active cooling
AssigneeFrore Systems Inc.
InventorsVikram Mukundan, Suryaprakash Ganti, Ananth Saran Yalamarthy, Prabhu Sathyamurthy, Seshagiri Rao Madhavapeddy
Life of this patent
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Abstract
A cooling system is described. The cooling system includes a cooling element and a support structure. The cooling element is configured to undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure. The cooling element includes a piezoelectric structure including a substrate having a first side and a second side opposite to the first side. A first piezoelectric layer is on the first side. A second piezoelectric layer is on the second side. The support structure is coupled to the cooling element and configured to support the cooling element.
Claims11
A cooling system, comprising:
- an orifice plate having a plurality of orifices therein;
- a cooling element configured to undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure, the cooling element including a piezoelectric structure including a substrate having a first side and a second side opposite to the first side, a first piezoelectric layer on the first side, and a second piezoelectric layer on the second side, wherein a first adhesive layer is sandwiched between the first piezoelectric layer and the first side, wherein a second adhesive layer is sandwiched between the second piezoelectric layer and the second side, wherein the first piezoelectric layer is on a different side of the substrate as the second piezoelectric layer, wherein the cooling element actuates to drive the fluid across the heat-generating structure to cool the heat-generating structure, wherein in the event that the fluid is driven toward the heat-generating structure, the fluid goes through an orifice of the plurality of orifices before going across the heat-generating structure, and wherein a projection on the orifice plate resides between the cooling element and the heat-generating structure;
- and
- a support structure coupled to the cooling element and configured to support the cooling element.
1 more element
A cooling system, comprising:
- an orifice plate having a plurality of orifices therein;
- a cooling element configured to undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure, the cooling element including a central portion having a first thickness and an outer portion having a second thickness less than the first thickness, wherein the cooling element includes a substrate, wherein a first piezoelectric layer being on a first surface of the substrate, wherein a second piezoelectric layer is on a second surface of the substrate opposite to the first surface of the substrate, wherein a first adhesive layer is sandwiched between the first piezoelectric layer and the first surface, and wherein a second adhesive layer is sandwiched between the second piezoelectric layer and the second surface, wherein the first piezoelectric layer is on a different side of the substrate as the second piezoelectric layer, wherein the cooling element actuates to drive the fluid across the heat-generating structure to cool the heat-generating structure, wherein in the event that the fluid is driven toward the heat-generating structure, the fluid goes through an orifice of the plurality of orifices before going across the heat-generating structure, and wherein a projection on the orifice plate resides between the cooling element and the heat-generating structure;
- and
- a support structure coupled to the cooling element and configured to support the cooling element at the central portion.
1 more element
A method of cooling a heat-generating structure, comprising:
- driving a cooling element to induce a vibrational motion at a frequency, the cooling element including a piezoelectric structure including a substrate having a first side and a second side opposite to the first side, a first piezoelectric layer on the first side, and a second piezoelectric layer on the second side, wherein a first adhesive layer is sandwiched between the first piezoelectric layer and the first side, and wherein a second adhesive layer is sandwiched between the second piezoelectric layer and the second side, wherein the first piezoelectric layer is on a different side of the substrate as the second piezoelectric layer, wherein the cooling element actuates to drive a fluid across a heat-generating structure to cool the heat-generating structure, wherein in the event that the fluid is driven toward the heat-generating structure, the fluid goes through an orifice of a plurality of orifices on an orifice plate before going across the heat-generating structure, and wherein a projection on the orifice plate resides between the cooling element and the heat-generating structure.
Dependencies are inferred from the claim text.