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US 12,317,659 B2Granted
Method of making a packaged device
AssigneeTslc Corporation
InventorsChen-Fu Chu, Trung Tri Doan
Life of this patent
Estimating the term…
Abstract
A packaged LED device comprising: a pad-extended LED chip comprising: at least one LED chip having a substrate, a first semiconductor layer, an active layer and a second semiconductor layer; a first pad electrically connected to the first type semiconductor layer and a second pad electrically connected to the second type semiconductor layer; and a first extended metal layer connected to the first pad and a second extended metal layer connected to the second pad.
Claims13
A pad-extended LED chip comprising:
- a LED chip comprising a substrate, a first type semiconductor layer, an active layer and a second type semiconductor layer;
- a first pad electrically connected to the first type semiconductor layer and a second pad electrically connected to the second type semiconductor layer;
- a first pad extended metal layer making direct physical and electrical contact to the first pad and a second pad extended metal layer making direct physical and electrical contact to the second pad;
- and
- a first package extended pad electrically connected to the first pad extended metal layer and a second package extended pad electrically connected to the second pad extended metal layer.
2 more elements
A packaged LED device comprising:
- a pad-extended LED chip comprising:
- an LED chip comprising a substrate, a first type semiconductor layer, an active layer and a second type semiconductor layer, and
- a first pad electrically connected to the first type semiconductor layer and a second pad electrically connected to the second type semiconductor layer;
- and
- a first pad extended metal layer making direct physical and electrical contact to the first pad and a second pad extended metal layer making direct physical and electrical contact to the second pad;
- a polymer layer covering substantially all of the pad-extended LED chip except surfaces of the first extended metal layer and the second extended metal layer;
- and
- a first package extended pad electrically connected to the first pad extended metal layer and a second package extended pad electrically connected to the second pad extended metal layer;
- wherein a sum of a first length of the first package extended pad, a second length of the second package extended pad and a spacing therebetween is larger than a third length of the LED chip.
6 more elements
A packaged LED device comprising:
- a pad-extended LED chip comprising:
- an LED chip comprising a substrate, a first type semiconductor layer, an active layer and a second type semiconductor layer;
- and
- a first pad electrically connected to the first type semiconductor layer and a second pad electrically connected to the second type semiconductor layer;
- a first pad extended metal layer making direct physical and electrical contact to the first pad and a second pad extended metal layer making direct physical and electrical contact to the second pad;
- a polymer layer covering substantially all of the pad-extended LED chip except surfaces of the first pad extended metal layer and the second pad extended metal layer;
- an opaque layer on the polymer layer;
- and
- a first package extended pad electrically connected to the first pad extended metal layer and a second package extended pad electrically connected to the second pad extended metal layer.
6 more elements
Dependencies are inferred from the claim text.