Isolation device with safety fuse
AssigneeTexas Instruments Incorporated
InventorsHonglin Guo, Thomas Dyer Bonifield
Life of this patent
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Abstract
A semiconductor device can include first and second conductive layers that can be positioned over a substrate, and at least one dielectric layer between the first and second conductive layers. The at least one dielectric layer can be positioned over at least a portion of the second conductive layer, and the first conductive layer can be positioned over a portion of the least one dielectric layer. The semiconductor device can further include a third conductive layer that can be positioned over the substrate and can be conductively connected to the second conductive layer and the substrate. The third conductive layer includes a fusible link.
Claims17
A semiconductor device comprising:
- first and second conductive layers positioned over a substrate;
- at least one dielectric layer between the first and second conductive layers, wherein the at least one dielectric layer is positioned over at least a portion of the second conductive layer, and the first conductive layer is positioned over a portion of the at least one dielectric layer;
- and
- a third conductive layer positioned over the substrate and conductively connected to the second conductive layer and the substrate, wherein the third conductive layer includes a fusible link having fuse body connected to two fuse terminals by corresponding tapered metal portions.
An integrated circuit (IC) comprising:
- upper and lower electrodes located over a substrate, and separated by a dielectric layer, the lower electrode located directly between the upper electrode and the substrate;
- an interconnect network that conductively connects the lower electrode to the substrate and to a first terminal of a fusible link;
- and
- a wire bonded to a second terminal of the fusible link.
A semiconductor device comprising:
- first and second conductive layers positioned over a substrate located in a device package;
- at least one dielectric layer between the first and second conductive layers, wherein the at least one dielectric layer is positioned over at least a portion of the second conductive layer, and the first conductive layer is positioned over a portion of the at least one dielectric layer;
- a third conductive layer positioned over the substrate and conductively connected to the second conductive layer and the substrate, wherein the third conductive layer includes a fusible link;
- a first wire connected between a first package terminal and the first conductive layer;
- and
- a second wire is connected between a second package terminal and the fusible link.
Dependencies are inferred from the claim text.