Thermal mitigation for an electronic speaker device and associated apparatuses and methods

A method comprising:

• determining a first temperature corresponding to a first thermal zone of an electronic device;
• determining a second temperature corresponding to a second thermal zone of the electronic device, wherein;
• each of the first thermal zone and the second thermal zone includes one selected from a group consisting of a System-on-Chip (SoC) the SoC integrated circuit component of the electronic device, a temperature of an exterior surface of a housing component of the electronic device, and one or more other circuit components of the electronic device;
• and
• the first thermal zone is different from the second thermal zone;
• based at least in part on the first temperature and the second temperature, using a cascading set of throttling schemes to perform thermal mitigation at least in part by:
• in response to an indication that the first temperature has exceeded a first threshold temperature or the second temperature has exceeded a second threshold temperature, triggering a first throttling scheme;
• and
• after the triggering of the first throttling scheme and after determining that a temperature corresponding to the first thermal zone does not exceed the first temperature threshold or a temperature corresponding to the second thermal zone does not exceed the second temperature threshold, triggering a second throttling scheme in response to an indication that a third temperature has exceeded a third threshold temperature, where the third temperature corresponds to a third thermal zone, wherein:
• the third thermal zone includes one selected from the group consisting of the SoC integrated circuit component, a temperature of an exterior surface of the housing component, and the one or more other circuit components;
• and
• the third thermal zone is different from the first thermal zone and the second thermal zone;
• wherein one of the first throttling scheme and the second throttling scheme comprises reducing an amount of power supplied to the SoC integrated circuit component by disabling one or more, but less than all, computer processing unit (CPU) cores of the SoC integrated circuit component;
• and
• wherein another of the first throttling scheme and the second throttling scheme comprises reducing an amount of power supplied to the one or more other circuit components.

A non-transitory, processor-readable medium comprising processor-executable instructions that, when executed by one or more processing devices, cause the one or more processing devices to perform operations comprising:

• determining a first temperature corresponding to a first thermal zone of an electronic device;
• determining a second temperature corresponding to a second thermal zone of the electronic device, wherein:
• each of the first thermal zone and the second thermal zone includes one selected from a group consisting of a System-on-Chip (SoC) integrated circuit component of the electronic device, a temperature of an exterior surface of a housing component of the electronic device, and one or more other circuit components of the electronic device;
• and
• the first thermal zone is different from the second thermal zone;
• based at least in part on the first temperature and the second temperature, using a cascading set of throttling schemes to perform thermal mitigation at least in part by:
• in response to an indication that the first temperature has exceeded a first threshold temperature or the second temperature has exceeded a second threshold temperature, triggering a first throttling scheme;
• and
• after the triggering of the first throttling scheme and after determining that a temperature corresponding to the first thermal zone does not exceed the first temperature threshold or a temperature corresponding to the second thermal zone does not exceed the second temperature threshold, triggering a second throttling scheme in response to an indication that a third temperature has exceeded a third threshold temperature, where the third temperature corresponds to a third thermal zone;
• wherein one of the first throttling scheme and the second throttling scheme comprises reducing an amount of power supplied to the SoC integrated circuit component by disabling one or more, but less than all, computer processing unit (CPU) cores of the SoC integrated circuit component, wherein:
• the third thermal zone includes one selected from the group consisting of the SoC integrated circuit component, a temperature of an exterior surface of the housing component, and the one or more other circuit components;
• and
• the third thermal zone is different from the first thermal zone and the second thermal zone;
• and
• wherein another of the first throttling scheme and the second throttling scheme comprises reducing an amount of power supplied to the one or more other circuit components.