Semiconductor device

A semiconductor device, comprising:

• a semiconductor chip including first and second electrodes and a conductive layer, the semiconductor chip having a first surface, a second surface, four side surfaces, four corners, and four sides, the second surface being provided at a side opposite to the first surface, the four side surfaces connecting the first surface and the second surface, two of the four side surfaces contacting each other at one of the four corners, the four side surfaces contacting the second surface at the four sides, the first and second electrodes being provided at the first surface, and the conductive layer being provided at the second surface;
• and
• a metal plate connected to the second surface side of the semiconductor chip, the metal plate including a third surface, a fourth surface, and a through-hole or a notch, the third surface being connected to the second surface of the semiconductor chip, the fourth surface being provided at a side opposite to the third surface, and the through-hole or the notch extending through the metal plate from the fourth surface to the third surface,
• wherein at least two sides of the four sides are partially visible via the through-hole or the notch at the fourth surface side of the metal plate.

A semiconductor device, comprising:

• a semiconductor chip including first and second electrodes and a conductive layer, the semiconductor chip having a first surface, a second surface, four side surfaces, four corners, and four sides, the second surface being provided at a side opposite to the first surface, the four side surfaces connecting the first surface and the second surface, two of the four side surfaces contacting each other at one of the four corners, the four side surfaces contacting the second surface at the four sides, the first and second electrodes being provided at the first surface, and the conductive layer being provided at the second surface;
• and
• a metal plate connected to the second surface side of the semiconductor chip, the metal plate including a third surface, a fourth surface, and a through-hole or a notch, the third surface being connected to the second surface of the semiconductor chip, the fourth surface being provided at a side opposite to the third surface, and the through-hole or the notch extending through the metal plate from the fourth surface to the third surface,
• wherein the metal plate includes grooves located at the third surface side, and the grooves are provided respectively at positions corresponding to the four sides of the semiconductor chip.