# US 12,315,760 B2 · Method for manufacturing electronic component device

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- Number: US 12,315,760 B2
- Document ID: US12315760B2
- Status: Granted
- Kind: B2
- Application number: 17/435,630
- Filed: 2020-03-05
- Published: 2022-05-12
- Granted: 2025-05-27
- Earliest claimed: 2019-03-06
- Assignees: Resonac Corporation
- Applicants: Showa Denko Materials Co., Ltd.
- Inventors: Tomoaki Shibata; Tsuyoshi Ogawa; Xinrong Li
- Web page: https://patentgrep.com/patent/US12315760B2

## CPC

- H10W 20/091: {by printing or stamping}
- H10W 74/129: {forming a chip-scale package [CSP]}
- H05K 3/00: Apparatus or processes for manufacturing printed circuits
- H05K 3/40: Forming printed elements for providing electric connections to or between printed circuits
- H10W 20/056: {by filling conductive material into holes, grooves or trenches}
- H10W 74/01: Manufacture or treatment
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 72/00: Interconnections or connectors in packages
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

Disclosed is a method for manufacturing an electronic component including: forming a via hole extending in a thickness direction of a curable sealing resin layer provided on a base material by an imprint method of pressing a mold into the sealing resin layer from a side opposite to the base material; curing the sealing resin layer; filling the via hole with a conductor precursor; and forming a conductive via by heating the conductor precursor filled in the via hole.

## Claims

### Claim 1

A method for manufacturing an electronic component device, the method comprising:
forming a via hole extending in a thickness direction of a curable sealing resin layer provided on a base material by an imprint method of pressing a mold into the sealing resin layer from a side opposite to the base material, wherein a semiconductor element is provided on the base material, and the semiconductor element is sealed by the sealing resin layer;
curing the sealing resin layer;
filling the via hole with a conductor precursor; and
forming a conductive via by heating the conductor precursor filled in the via hole, wherein the via hole has a depth of 30 to 500 μm.

### Claim 2 (depends on 1)

The method according to claim 1, wherein a ratio of the depth of the via hole to a maximum width of the via hole is 1 or more.

### Claim 3 (depends on 2)

The method according to claim 2, wherein the ratio of the depth of the via hole to the maximum width of the via hole is 10 or less.

### Claim 4 (depends on 1)

The method according to claim 1, wherein a ratio of the depth of the via hole to a maximum width of the via hole is 2 or more.

### Claim 5 (depends on 4)

The method according to claim 4, wherein the ratio of the depth of the via hole to the maximum width of the via hole is 10 or less.

### Claim 6 (depends on 4)

The method according to claim 4, wherein the maximum width of the via hole is 10 to 200 μm.

### Claim 7 (depends on 1)

The method according to claim 1, wherein the curable sealing resin layer is cured prior to filling the via hole with the conductor precursor.

### Claim 8

A method for manufacturing an electronic component device, the method comprising:
forming a via hole extending in a thickness direction of a curable sealing resin layer provided on a base material by an imprint method of pressing a mold into the sealing resin layer from a side opposite to the base material, wherein a semiconductor element is provided on the base material, and the semiconductor element is sealed by the sealing resin layer;
curing the sealing resin layer;
filling the via hole with a conductor precursor, wherein the conductor precursor comprises a plurality of metallic particles and an organic binder in which the plurality of metallic particles are dispersed; and
forming a conductive via by heating the conductor precursor filled in the via hole, wherein the via hole has a depth of 30 to 500 μm, wherein when the conductor precursor is heated, the plurality of metallic particles form a metallic sintered body through transitional liquid phase sintering, thereby forming the conductive via comprising the metallic sintered body.

### Claim 9

A method for manufacturing an electronic component device, the method comprising:
forming a via hole extending in a thickness direction of a curable sealing resin layer provided on a base material by an imprint method of pressing a mold into the sealing resin layer from a side opposite to the base material;
curing the sealing resin layer;
filling the via hole with a conductor precursor, wherein the conductor precursor comprises a plurality of metallic particles and an organic binder in which the plurality of metallic particles are dispersed, and the organic binder comprises a thermoplastic resin having a polyoxyalkylene group or a polysiloxane group; and
forming a conductive via by heating the conductor precursor filled in the via hole, wherein the via hole has a depth of 30 to 500 μm.

### Claim 10

A method for manufacturing an electronic component device, the method comprising:
forming a via hole extending in a thickness direction of a curable sealing resin layer provided on a base material by an imprint method of pressing a mold into the sealing resin layer from a side opposite to the base material;
filling the via hole with a conductor precursor;
curing the sealing resin layer, wherein the sealing resin layer is cured after filling the via hole with the conductor precursor; and
forming a conductive via by heating the conductor precursor filled in the via hole, wherein the via hole has a depth of 30 to 500 μm.