Treatment condition setting method, storage medium, and substrate treatment system

A method of setting a treatment condition of a substrate treatment in a substrate treatment system, the method comprising:

• acquiring an image of a reference substrate being a substrate which is a reference for setting the treatment condition of the substrate treatment in the substrate treatment system, wherein the substrate treatment is at least one of a treatment for forming a film pattern, a treatment for forming a predetermined film on the substrate, a treatment for etching the substrate, and a treatment for etching a predetermined film on the substrate;
• acquiring an image of a treated substrate being a substrate on which the substrate treatment has been performed under the treatment condition being a first treatment condition by the substrate treatment system prior to setting a second treatment condition;
• calculating a deviation amount in information between the image of the treated substrate and the image of the reference substrate, wherein the information is correlated with a line width or thickness of a film;
• calculating a correction amount of the treatment condition of the substrate treatment based on a correlation model indicating a correlation between a deviation amount in the information in the image of the treated substrate and a change amount in the treatment condition and on the deviation amount in the information;
• setting the second treatment condition of the substrate treatment based on the calculated correction amount and on the first treatment condition;
• and
• performing the substrate treatment based on the treatment condition being the second treatment condition set by the setting,
• wherein the substrate treatment system comprises a treatment apparatus configured to perform at least one of the treatment for forming the film pattern, the treatment for forming the predetermined film on the substrate, the treatment for etching the substrate, and the treatment for etching the predetermined film on the substrate, and
• wherein the performing the substrate treatment treats, by the treatment apparatus, a target substrate based on the second treatment condition set by the setting.