Insulating layer for multilayer printed circuit board, multilayer printed circuit board comprising same, and method for producing same
AssigneeLG Chem, Ltd.
InventorsJeong Wook Mun, Kong Kyeom Kim, Woo Jae Jeong, Jee Hyeon Hwang, Eun Byurl Cho, Jeong Hyuk Ahn
Life of this patent
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Abstract
The present disclosure provides an insulating layer for a multilayer printed circuit board, a multilayer printed circuit board including the same, and a method for fabricating the same. The insulating layer of the present disclosure includes a polymer resin layer containing a melamine derivative, and thus may have excellent adhesion to a patterned metal layer.
Claims15
An insulating layer for a multilayer printed circuit board, the insulating layer comprising a patterned polymer resin layer containing an alkali-soluble resin, a thermosetting binder, and a melamine derivative, wherein the melamine derivative has a structure of the following Chemical Formula 1:
- wherein A is an alkyl group containing 1 to 6 carboxyl groups, or an amine group containing 2 to 6 carboxyl groups.
An insulating layer for a multilayer printed circuit board, the insulating layer comprising a patterned polymer resin layer containing an alkali-soluble resin, a thermosetting binder, and a melamine derivative, wherein the melamine derivative has a structure of the following Chemical Formula 1:
- wherein A is an alkyl group containing 1 to 6 carboxyl groups, or an amine group containing 1 to 6 carboxyl groups,
- wherein the alkali-soluble resin contains:
- one or more acidic functional groups;
- and a cyclic imide functional group substituted with one or more amino groups, and
- wherein the cyclic imide functional group substituted with one or more amino groups include a functional group represented by the following Formula 1:
- wherein R1 is an alkylene group or alkenyl group having 1 to 10 carbon atoms, or 1 to 5 carbon atoms, or 1 to 3 carbon atoms, and “*” represents a bonding point.
An insulating layer for a multilayer printed circuit board, the insulating layer comprising a patterned polymer resin layer containing an alkali-soluble resin, a thermosetting binder, and a melamine derivative, wherein the melamine derivative has a structure of the following Chemical Formula 1:
- wherein A is an alkyl group containing 1 to 6 carboxyl groups, or an amine group containing 1 to 6 carboxyl groups,
- wherein the alkali-soluble resin contains:
- one or more acidic functional groups;
- and a cyclic imide functional group substituted with one or more amino groups, and
- wherein the cyclic imide functional group substituted with one or more amino groups include a functional group represented by the following Formula 2:
- wherein “*” represents a bonding point.
An insulating layer for a multilayer printed circuit board, the insulating layer comprising a patterned polymer resin layer containing an alkali-soluble resin, a thermosetting binder, and a melamine derivative, wherein the melamine derivative has a structure of the following Chemical Formula 1:
- wherein A is an alkyl group containing 1 to 6 carboxyl groups, or an amine group containing 1 to 6 carboxyl groups,
- wherein the alkali-soluble resin includes at least one repeating unit represented by the following Formula 3 and at least one repeating unit represented by the following Formula 4:
- wherein R2 is a direct bond, an alkylene group having 1 to 20 carbon atoms, an alkenyl group having 1 to 20 carbon atoms, or an arylene group having 6 to 20 carbon atoms, and “*” represents a bonding point,
- wherein R3 is a direct bond, an alkylene group having 1 to 20 carbon atoms, an alkenyl group having 1 to 20 carbon atoms, or an arylene group having 6 to 20 carbon atoms, R4 is —H, —OH, —NR5R6, a halogen, or an alkyl group having 1 to 20 carbon atoms, R5 and R6 may be each independently hydrogen, an alkyl group having 1 to 20 carbon atoms, or an aryl group having 6 to 20 carbon atoms, and “*” represents a bonding point.
Dependencies are inferred from the claim text.