Thermal management system for multi-chip-module and associated methods

A thermal management system for an electronic package, comprising:

• a first thermal-transfer-environment thermally connected to a heat source within the electronic package;
• a second thermal-transfer-environment thermally connected to a temperature-sensitive component within the electronic package, wherein the second thermal-transfer-environment is substantially thermally separated from the first thermal-transfer-environment;
• a first heat transfer member within the first thermal-transfer-environment and a second heat transfer member within the second thermal-transfer-environment, the first heat transfer member thermally separated from the second heat transfer member by a thermal break, wherein the first heat transfer member is positioned to wrap around at least two proximately positioned sides of the second heat transfer member, and wherein the thermal break is maintained between the at least two proximately positioned sides of the first and second heat transfer members;
• and
• a thermally conductive plate in contact with both the first heat transfer member and the second heat transfer member, the thermally conductive plate including at least one perforation aligned with the thermal break.