Real-time modification of line focus intensity distribution
AssigneeCorning Incorporated
InventorsReinhard Moritz Malchus, Tobias Christian Roeder
Life of this patent
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AssigneeCorning Incorporated
InventorsReinhard Moritz Malchus, Tobias Christian Roeder
Estimating the term…
Methods, systems, devices, and substrates are described. In some examples, an apparatus may include optical components configured to adjust an input to a laser cutting optic for modifying a substrate (e.g., an optically transmissive substrate). In some examples, the optical components may include a beam deflector, a first optic configured to output a first laser beam with a first beam width, and a second optic configured to output a second laser beam with a second beam width. In some examples, the beam deflector may modify an optical path of a pulsed laser (e.g., through the first optic or through the second optic), which may result in an input to the laser cutting optic having a beam width corresponding to the first optic or the second optic. The different input beam widths may modify a line focus intensity of an output of the laser cutting optic when modifying the substrate.
A method, comprising:
Dependencies are inferred from the claim text.