Platinum electrolyte
AssigneeUmicore Galvanotechnik GmbH
InventorsUwe Manz, Bernd Weyhmueller
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Abstract
The present invention is directed toward a platinum electrolyte which contains certain additives, and to a method for the electrolytic deposition of a platinum layer with the aid of the electrolyte according to the invention.
Claims12
An aqueous, cyanide-free electrolyte for the deposition of platinum or platinum alloys on electrically conductive substrates, wherein the electrolyte (a) has one or more ions selected from the group consisting of Ir, Bi, Sb, Se, and Te, wherein Bi, Sb, Se, and Te are present in a concentration of up to 100 mg/l of electrolyte and Ir is present in a concentration of up to 500 mg/l of electrolyte, (b) does not contain hydrochloric acid, (c) has platinum sulfamate complexes, (d) a pH of <2, and (e) lacks particles of platinum or platinum alloys when under a current density of up to 5A/dm2.
An aqueous, cyanide-free electrolyte for the deposition of platinum or platinum alloys on electrically conductive substrates, wherein the electrolyte (a) has one or more ions selected from the group consisting of Bi, Sb, Se, and Te in a concentration of up to 100 mg/l of electrolyte, (b) does not contain hydrochloric acid, (c) has platinum sulfamate complexes, (d) a pH of <2, and (e) lacks particles of platinum or platinum alloys when under a current density of up to 5A/dm2.
Dependencies are inferred from the claim text.