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US 12,312,510 B2Granted
Adhesive film and flexible printed circuit board
AssigneeMektec Corporation
InventorsHisae Oba, Hiroyuki Komori, Nozomu Suzuki
Life of this patent
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Abstract
An adhesive film includes: a resin film layer; and an adhesive layer laminated to the resin film layer, in which the adhesive layer includes an adhesive agent, the adhesive layer is in a B stage state, an oxygen transmission rate at 200° C. of the resin film layer, measured in accordance with JIS K7126-1, is 1.50×10−10 cc·cm/cm2·sec·cmHg or less, and a 3% thermal weight reduction temperature of the adhesive agent is 320° C. or higher.
Claims7
An adhesive film comprising:
- a resin film layer;
- and
- an adhesive layer laminated to the resin film layer, wherein
- the adhesive layer includes an adhesive agent,
- the adhesive agent contains a fluorine-based rubber,
- the adhesive layer is in a B stage state,
- the resin film layer includes a liquid crystal polymer,
- an oxygen transmission rate at 200° C. of the resin film layer, measured in accordance with JIS K7126-1, is 1.50×10−10 cc·cm/cm2·sec·cmHg or less, and
- a 3% thermal weight reduction temperature of the adhesive agent is 320° C. or higher.
6 more elements
Dependencies are inferred from the claim text.