Radio frequency heating for rapid curing of nanocomposite adhesives

Abstract

A non-contact method of joining two components via direct heating of a thermoset adhesive includes applying the thermoset adhesive to at least a first component of the two components. The thermoset adhesive includes a susceptor to reacts in the presence of an electromagnetic field. The method includes placing the first component and a second component of the two components in proximity to an electromagnetic field. In some aspects, the method includes placing the first and second components in proximity to an electromagnetic field of a capacitor. The susceptor interacts with the electromagnetic field to heat the thermoset adhesive via resistive heating. In some aspects, a method of direct-contact heating of the thermoset adhesive includes attaching electrodes to a film comprising the adhesive. The components being joined together are not directly heated by the electromagnetic field, and as a result experience much lower temperatures than the thermoset adhesive.

Dependencies are inferred from the claim text.