Thermally reworkable adhesives for electronic devices
AssigneeInternational Business Machines Corporation
InventorsJoseph Michael Dennis, Andy Theodora Tek, Robert David Allen
Life of this patent
Estimating the term…
Abstract
A thermally reworkable adhesive includes at least one di-epoxide, at least one diamine that is reactive with the at least one di-epoxide, at least one additive that is miscible, but not reactive, with the at least one di-epoxide and/or the at least one diamine. Reaction of the at least one di-epoxide and the at least one diamine forms a crosslinked polymer network and the at least one additive offsets the stoichiometry of the crosslinked polymer network by 5-50%. The offset crosslinked polymer network forms the thermally reworkable adhesive that once cured, at a temperature in the range of 20-200° C., can be de-bonded from a device to which it is attached at a temperature in the range of 50-200° C.
Claims13
A composition comprising:
- at least one di-epoxide present in the composition in a weight ratio range of 55-73%;
- at least one diamine that is reactive with the at least one di-epoxide and is present in the composition in a weight ratio range of 12-18%;
- and
- at least one additive that is miscible, but not reactive, with the at least one di-epoxide and/or the at least one diamine, the at least one additive including at least one epoxide, and the at least one additive including a phenoxy-based functional filler having a weight percent in the composition in a range of 5-20%,
- wherein a reaction of the at least one di-epoxide and the at least one diamine produces a crosslinked polymer network,
- wherein the crosslinked polymer network comprises a thermally reworkable adhesive that once cured, can be de-bonded from a device to which it is attached at a temperature range of 50-200° C., and
- wherein a molar ratio of the at least one di-epoxide and the at least one additive to the least one diamine is present in the composition in a molar ratio of 1.66 to 2.16.
A composition comprising:
- at least one di-epoxide present in the composition in a weight ratio range of 55-73%;
- at least one diamine that is reactive with the at least one di-epoxide and is present in the composition in a weight ratio range of 12-18%;
- and
- at least one additive comprising a phenoxy-based functional filler having a weight percent in the composition in a range of 5-20%, at least one reactive diluent, and at least one epoxide, wherein the at least one additive is miscible, but not reactive, with the at least one di-epoxide and/or the at least one diamine,
- wherein a reaction of the at least one di-epoxide and the at least one diamine produces a crosslinked polymer network,
- wherein the crosslinked polymer network comprises a thermally reworkable adhesive that once cured, can be de-bonded from a device to which it is attached at a temperature range of 50-100° C., and
- wherein a molar ratio of the at least one di-epoxide and the at least one additive to the least one diamine is present in the composition in a molar ratio of 1.66 to 2.16.
A method comprising:
- mixing a formulation comprising at least one di-epoxide present in the composition in a weight ratio range of 55-73%, at least one diamine that is reactive with the at least one di-epoxide and is present in the composition in a weight ratio range of 12-18%, and at least one additive, the at least one additive including at least one epoxide, and the at least one additive including a phenoxy-based functional filler having a weight percent in the composition in a range of 5-20%, wherein (i) the at least one additive is miscible, but not reactive, with the at least one di-epoxide and/or the at least one diamine;
- (ii) a reaction of the at least one di-epoxide and the at least one diamine produces a crosslinked polymer network, and (iii) the crosslinked polymer network comprises a thermally reworkable adhesive;
- applying the thermally reworkable adhesive to a device;
- curing the thermally reworkable adhesive onto the device;
- heating the cured thermally reworkable adhesive to a temperature in the range of 50-200° C.;
- and
- removing the cured thermally reworkable adhesive from the device,
- wherein a molar ratio of the at least one di-epoxide and the at least one additive to the least one diamine is present in the formulation in a molar ratio of 1.66 to 2.16.
Dependencies are inferred from the claim text.