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US 12,312,323 B2Granted
Compound, method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
AssigneeMitsubishi Gas Chemical Company, Inc.
InventorsShunsuke Katagiri, Takuya Suzuki, Seiji Shika, Yune Kumazawa
Life of this patent
Estimating the term…
Abstract
The compound (A) is represented by formula (1). R1O—R2—OR1 (1) (In formula (1), each R1 independently represents a group represented by formula (2), or a hydrogen atom, and R2 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms, provided that at least one R1 is a group represented by formula (2).) (In formula (2), -* represents a bonding hand.).
Claims13
A compound (A) represented by the following formula (1):
- R1O—R2—OR1 (1)
- wherein each R1 independently represents a group represented by the following formula (2), or a hydrogen atom, and R2 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms;
- provided that at least one R1 is a group represented by the following formula (2):
- wherein -* represents a bonding hand.
1 more element
Dependencies are inferred from the claim text.