Apparatus and method for machining hole for optical film

A method of hole machining an optical film using a hole machining apparatus,

• wherein the hole machining apparatus comprises:
• a clamping part for fixing a plurality of optical films in a laminated state;
• and
• a machining part for performing a hole operation on a predetermined region of the plurality of optical films so as to sequentially pass through the optical films along the laminated direction in a state where the optical films are fixed to the clamping part,
• wherein the machining part comprises:
• a drill bit provided to perform a primary hole operation;
• and
• a cutting bite provided to perform a secondary hole operation in the primary hole operation region,
• wherein the hole machining apparatus further comprises an alignment part for aligning the positions of the drill bit and the cutting bite upon the primary and secondary hole operations,
• wherein the method comprises:
• clamping the plurality of optical films in a laminate state at a predetermined pressure in the hole machining apparatus;
• first punching through the plurality of optical films in a laminated state in order along the lamination direction using the drill bit;
• and
• second punching the first punched region with the cutting bite,
• wherein hole machining operation is performed so that the centers of the holes coincide with each other upon the first punching and the second punching,
• wherein the plurality of optical films comprise a polarizing plate,
• wherein the clamping pressure is 0.1 to 0.2 MPa,
• wherein upon the first punching, the drill bit operates at 30,000 to 50,000 RPM and operates at a feeding speed of 2000 to 5000 mm/min,
• wherein upon the second punching, the cutting bite operates at 30,000 to 50,000 RPM and operates at a feeding speed of 2000 to 5000 mm/min, and
• wherein the hole machining operation is performed so that the diameter of the first punched hole is smaller than the diameter of the second punched hole.