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US 12,311,437 B2Granted
Thixomolding material
AssigneeSeiko Epson Corporation
InventorsYasutoshi Hideshima, Setsuya Iwashita, Fumiya Maeda, Shunsuke Uchizono, Koichi Ozaki, Tadao Fukuta
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Abstract
Provided is a thixomolding material including a metal body that contains Mg as a main component, and a coating portion that is adhered to a surface of the metal body via a binder and contains C particles containing C as a main component. A mass fraction of the C particles in a total mass of the metal body and the C particles is 5.0 mass % or more and 40.0 mass % or less. The binder may contain waxes. The C particles may be graphite particles.
Claims3
A thixomolding material comprising:
- a metal body that contains Mg as a main component, wherein Mg has highest content by mass in the metal body than other additive components in the metal body;
- and
- a coating portion that is adhered to a surface of the metal body via a binder and contains C particles containing C, wherein
- an average particle diameter of the C particles is 1 μm or more and 100 μm or less, and
- a mass fraction of the C particles in a total mass of the metal body and the C particles is 5.0 mass % or more and 40.0 mass % or less.
2 more elements
Dependencies are inferred from the claim text.