Smart pack for medicines
AssigneeSwyft Inc.
InventorsKevin M. Conlon, Craig N. Changstrom, John Michael Main
Life of this patent
Estimating the term…
Abstract
Disclosed is a blister pack smart dispensing package that has an overlay with conductors located over blister pack pockets that are broken when a user retrieves a solid medication, such as a pill, from the blister pack. The date and time that the user retrieved the solid medication from the smart pack is recorded by an electronics and communications package on the smart pack. A local communications device then receives this adherence data and transmits this data to a server, which generates a data structure containing adherence data. A blister pack overlay can be used which changes colors to indicate that the medication is about to expire, or has expired.
Claims15
An apparatus comprising:
- an overlay configured for operative attachment to a blister pack, the blister pack configured to dispense medication from each of a plurality of blister pockets configured to contain the medication, the overlay comprising:
- a plurality of geometric pattern conductors disposed on the overlay, each of the plurality of geometric pattern conductors configured to align with a corresponding one of the plurality of blister pockets when the overlay is operatively attached to the blister pack and to create an open circuit when the medication is removed from the corresponding one of the plurality of blister pockets, and
- a plurality of connecting conductors disposed on the overlay that are electrically coupled to the plurality of geometric pattern conductors and configured to detect the open circuit and to identify the corresponding one of the plurality of geometric pattern conductors, wherein the plurality of connecting conductors interconnect at least some of the plurality of geometric pattern conductors with one another.
Dependencies are inferred from the claim text.